Photonics Packaging Engineer
Hybrid Remote/SF Bay Area/Austin/Boston·Posted 3mo ago
<p><strong>What We're Looking For:</strong></p> <p>We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages. </p> <p>This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.</p> <p> </p> <p><strong>Ideal Background:</strong></p> <ul> <li>Experience with integrated photonics package assemblies with multiple dies </li> <li>Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors</li> <li>Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc. </li> </ul> <p> </p> <p><strong>Nice to Have:</strong></p> <ul> <li>Experience with large device count photonic assemblies </li> <li>Experience with clear underfill</li> <li>Experience with high density fiber attach</li> <li>Experience with large substrate size photonic MCM assemblies </li> <li>Hands-on experience with PIC design</li> </ul> <p> </p>